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High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

Brand Name:	Customized
MOQ:	1 panel
Price:	Negotiation
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ISO9001, ISO13485,IS014001

Board Type:

6 Layer

Base Material:

FR4/ROGERS/High Tg

Solder Mask:

Green Solder Mask

Minimum Solder Mask Bridge:

0.1mm

Surface Finish:

EING

Service Type:

PCB Prototype/ Mass Production

Size:

Customized

Cu Thickness:

1OZ

Maximum Substrate Size:

24”x32”

Packaging Details:

Vacuum package

Highlight:

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Product Description

Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict, but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

Circuit width and spacing limits
Annular ring and aspect ratio limits, especially for high reliability designs and requirements
Material choice used in the board to ensure impedance control in the required stackup
Impedance profiles for the desired stackup or layer pairs if available
Blind vias connect exterior layer to at least one interior layer without penetrating the entire board.
Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type 0

Tags:

Flexible PCB Board

Rigid PCB

Copper PCB

Rigid Flex PCB

Aluminum PCB Board

HDI PCB

Heavy Copper PCB

Rogers PCB

LED PCB Board

Power PCB Assembly

PCB Winding

Quick Turn PCB

High Frequency PCB

EMS PCB Assembly

Flexible PCB Board

Rigid PCB

Copper PCB

Rigid Flex PCB

Aluminum PCB Board

HDI PCB

Heavy Copper PCB

Rogers PCB

LED PCB Board

Power PCB Assembly

PCB Winding

Quick Turn PCB

High Frequency PCB

EMS PCB Assembly

products details

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Product Description:

HDI PCB Design DFM Requirements