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china latest news about Welcome visit our booth B2 516/2 in 2023 Productronica Munich

Welcome visit our booth B2 516/2 in 2023 Productronica Munich

November 9, 2023

Golden Triangle Group Ltd, as a leading PCB production and design manufacturer, will participate in the Produtronica exhibition held in Munich, Germany in 2023. The Productronica 2023 exhibition is an excellent opportunity for us to have in-depth exchanges, share experiences and insights with ...
china latest news about Common PCB Board Materials and Dielectric Constants

Common PCB Board Materials and Dielectric Constants

May 10, 2023

Common PCB Board Materials and Dielectric Constants Introduction of PCB Materials They are generally divided into five categories according to the different reinforcement materials used for the boards: paper-based, glass fiber cloth-based, composite-based (CEM series), laminated multi-layer board...
china latest news about "Balanced Copper" in PCB Manufacturing

"Balanced Copper" in PCB Manufacturing

May 10, 2023

"Balanced Copper" in PCB Manufacturing PCB manufacturing is the process of building a physical PCB from a PCB design according to a certain set of specifications. Understanding the design specification is very important as it affects the manufacturability, performance and production yield of the PCB...
china latest news about Introduction to PCB Substrate Materials

Introduction to PCB Substrate Materials

May 10, 2023

Introduction to PCB Substrate Materials Copper-clad PCB mainly plays three roles in the entire printed circuit board: conduction, insulation, and support. Classification method of copper-clad PCB According to the rigidity of the board, it is divided into rigid copper-clad PCB and flexible copper...
china latest news about Difference Between PCB and PCBA

Difference Between PCB and PCBA

May 10, 2023

Difference Between PCB and PCBA What is PCB? PCB stands for Printed Circuit Board. It is a thin board made of insulating material, usually fiberglass or plastic, with conductive pathways or tracks printed onto it. The conductive pathways or tracks connect different components of the electronic ...
china latest news about Standard for Controlling PCB Baking Tubes

Standard for Controlling PCB Baking Tubes

May 10, 2023

Standard for Controlling PCB Baking Tubes PCB Unpacking and Storage If the PCB board is sealed and not unpacked, it can be used directly on the production line within 2 months of the manufacturing date. If the PCB board is unpacked within 2 months of the manufacturing date, the unpacking date must ...
china latest news about Compression of Multilayer PCBs

Compression of Multilayer PCBs

May 10, 2023

Compression of Multilayer PCBs Advantages of PCB Multilayer Boards High assembly density, small size, and light weight; Reduced interconnection between components (including electronic components), which improves reliability; Increased flexibility in design by adding wiring layers; Ability to create ...
china latest news about How To Avoid Pits And Leaks On The Design Side Of PCB Boards!

How To Avoid Pits And Leaks On The Design Side Of PCB Boards!

May 10, 2023

How To Avoid Pits And Leaks On The Design Side Of PCB Boards! The design of electronic products is from drawing schematic diagrams to PCB layout and wiring. Due to a lack of knowledge in this area of work experience, various mistakes often occur, hindering our follow-up work, and in severe cases, ...
china latest news about Testing Methods Of PCB

Testing Methods Of PCB

May 10, 2023

Testing Methods Of PCB Flying Probe Test The flying probe tester uses 4, 6, or 8 probes to perform high-voltage insulation and low-resistance continuity tests (open and short circuits of test lines) on PCB circuit boards without the need for test fixtures. Using "automatic optical focus positioning"...
china latest news about LDI Technology Is The Solution To The High-density PCB

LDI Technology Is The Solution To The High-density PCB

May 10, 2023

LDI Technology Is The Solution To The High-density PCB With the advancement of high integration and assembly (especially chip-scale/µ-BGA packaging) technology of electronic components (groups). Greatly it promotes the development of "light, thin, short, and small" electronic products, high...
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