Flexible Circuit Board is widely used in various electronic devices due to its lightweight and bendable characteristics. However, the flexibility of FPC also brings about the problem of insufficient strength, which makes it easy to break at the connection or stress points. FPC reinforcement usually involves pasting reinforcement materials at specific locations on the FPC, utilizing the mechanical properties of the reinforcement materials to enhance the strength of the FPC.
The purpose of FPC Stiffener is
Enhance mechanical strength: Improve the tensile, bending, and tear resistance of FPC in stressed areas such as connectors and component installation positions to prevent breakage.
Improve dimensional stability: reduce the deformation of FPC caused by factors such as temperature and humidity during processing and use, and ensure its dimensional accuracy.
Improving heat dissipation performance: Some reinforcing materials have good thermal conductivity, which can help dissipate heat from components on FPC.
Convenient assembly and soldering: Provides support for FPC, making it easier to assemble and solder.
Common FPC Stiffener materials
Polyimide (PI) Stiffener: generally used on the back of gold fingers for plugging and unplugging, to increase the thickness and mechanical strength of FPC to adapt to connector terminals, with thicknesses ranging from 0.05mm-0.275mm
FR-4 Stiffener: generally used for supporting chips or ICs, it can effectively increase the mechanical strength of FPC, improve its ability to resist bending and stretching, and has a conventional thickness ranging from 0.1mm to 1.5mm;
Metal Stiffener: Materials include steel sheet, aluminum sheet, copper sheet reinforcement, etc. The support function is similar to FR-4, but it has more features such as heat dissipation, grounding, and higher flatness compared to FR-4. It is generally used for high-end chips or IC back or some special applications. The conventional thickness ranges from 0.1mm to 0.4mm, and other thicknesses can also be customized
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