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HDI PCB
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HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity

HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity

Brand Name: Customized
MOQ: 1 Panle
Price: Negotiation
Payment Terms: T/T
Detail Information
Place of Origin:
China
Certification:
ISO9001,ISO13485, TS16949
Product Type:
6 Layer HDI PCB
Base Material:
FR4/ROGERS/Aluminum/High TG/Middle TG
Minimum Solder Mask Bridge:
0.08mm
Cu Thickness:
1OZ
Testing:
AOI Test
Solder Mask:
Black Solder Mask
Impedance Control:
±10%
Technology:
Blind Anv Burid Holes, Resin Plugging
Packaging Details:
Vacuum package
Highlight:

HDI PCB with 1OZ copper

,

high-density interconnect PCB

,

HDI circuit board superior conductivity

Product Description

Product Description:

 

About Blind hole and burid hole

When PCB space is constrained or plated through-hole design is limited, blind and buried vias can provide an effective solution.

Blind and buried via technology has been crucial for packing greater functionality into compact layouts. By shortening vias so they only traverse the necessary layers, more surface area is freed up for component placement.

These vias are employed to connect PCB layers where space is highly limited. A blind via links an outer layer to one or more inner layers without passing through the entire board. A buried via, on the other hand, connects two or more inner layers and does not reach any outer layer.

Key advantages include:

  • Meeting density requirements for traces and pads without adding layers or enlarging board size
  • Reducing the PCB aspect ratio

A blind via is a copper-plated hole that connects exactly one outer layer to one or more inner layers and does not penetrate the entire board. In design terms, blind vias are specified in a separate drill file.HDI printed circuit board incorporating 1OZ copper thickness ensuring superior electrical conductivity 0