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6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance

Brand Name:	Customisation
MOQ:	1pcs
Price:	Negotitation
Payment Terms:	Negotitation, T/T

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ISO9001, TS16949

Product Name:

Electronic PCB Assembly Manufacturer, Printed Circuit Board PCB Assembly, Assembly For Circuit Board

Layers:

6 LAYER

Material:

FR4 TG135

Board Thickness:

1.6mm+/-10%

Solder Mask:

Black

Surface Finish:

Immersion Gold

Service:

One-stop Turnkey Service, PCB Clone, PCB/Components Sourcing/Soldering/Progamming/Testing.., PCB&PCBA, SMT DIP Components Purchase

Type:

Printed Circuit Assembly

Testing Service:

Function Test, E-test Or Fly-probe According To Order Quantity, Fly-probe, E-test/Fixture Test/Functional Test

Application:

Consumer Electronics, And So On, Electronic Products Pcb Assembly, Medicine

Packaging Details:

Vacuum package

Highlight:

6 Layer PCB Assembly

2OZ Copper Thickness PCB Assembly

Black Soldermask PCB Assembly

Product Description

Product description:

Product type	Printed circuit board Assembly
Multilayer	6 layer
Material	FR4 Tg135 1.6mm
Copper thickness	2/1/1/1/1/2OZ
Surface finish	Immersion gold
Soldermask	Black

PCBA :Assembly Tehcnologies:

Surface Mount Technology (SMT): Components are mounted directly onto the surface of the PCB. This technology allows for smaller components and denser PCB layouts.

Through-Hole Technology (THT): Components with wire leads are inserted into holes in the PCB and soldered on the opposite side. THT is used for components requiring mechanical strength or heat dissipation.

Automated Optical Inspection (AOI): AOI systems use cameras and image processing algorithms to inspect solder joints and components for defects such as misalignment, missing components, or solder bridges.

X-Ray Inspection: X-ray machines are used to inspect hidden solder joints, check for voids in solder, and ensure the integrity of components like ball grid arrays (BGAs).

In-Circuit Testing (ICT): ICT involves testing the electrical connections on the PCB using test probes. This method is used to detect faults like open circuits, shorts, and incorrect components.

Flying Probe Testing: Instead of using dedicated test fixtures, flying probe testers have moving test probes that can adapt to various PCB designs, making them suitable for low-volume production.

Functional Testing: This involves testing the PCB while it is operational to ensure that it functions according to the design specifications.These processes and technologies collectively ensure the quality and reliability of PCB assemblies in electronic devices.

Tags:

Flexible PCB Board

Rigid PCB

Copper PCB

Rigid Flex PCB

Aluminum PCB Board

HDI PCB

Heavy Copper PCB

Rogers PCB

LED PCB Board

Power PCB Assembly

PCB Winding

Quick Turn PCB

High Frequency PCB

EMS PCB Assembly

Flexible PCB Board

Rigid PCB

Copper PCB

Rigid Flex PCB

Aluminum PCB Board

HDI PCB

Heavy Copper PCB

Rogers PCB

LED PCB Board

Power PCB Assembly

PCB Winding

Quick Turn PCB

High Frequency PCB

EMS PCB Assembly

products details

6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance

6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance

6 Layer PCB Assembly

2OZ Copper Thickness PCB Assembly

Black Soldermask PCB Assembly