Product features:
This rigid circuit board is used Ceramic substrate lamination WL-CT338.The ceramic substrate material is widely used in electronic packaging substrate for its advantages such as high strength, good insulation, good thermal conductivity and heat resistance, small thermal expansion coefficient and good chemical stability.
Product type | High Frequency PCB |
Materail | Ceramic substrate lamination WL-CT338 |
Board thickness | 0.544+/-10%mm |
Copper thickness | 1/1 OZ |
Surface finish | Immersion sliver |
Holes | Via in pad, resin plugging and plated over |
Soldermask | Green or per customer demand |
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