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2 Layer High Frequency PCB With WL-CT338 Ceramic Substrate Materail 0.55mm Immersion Sliver
  • 2 Layer High Frequency PCB With WL-CT338 Ceramic Substrate Materail 0.55mm Immersion Sliver
  • 2 Layer High Frequency PCB With WL-CT338 Ceramic Substrate Materail 0.55mm Immersion Sliver

2 Layer High Frequency PCB With WL-CT338 Ceramic Substrate Materail 0.55mm Immersion Sliver

Place of Origin China
Brand Name Customized
Certification ISO9001
Product Details
Product:
High Frequency PCB
Materail:
Ceramic Substrate Lamination WL-CT338
Board Thickness:
0.55mm
Copper Thickness:
1/1oz
Surface Finish:
Immersion Sliver Or Immersion Gold
Technology:
Resin Plugging And Plated Over
Holes:
Via In Pad
Highlight: 

2 layer high frequency PCB

,

0.55mm high frequency PCB

,

WL-CT338 high frequency PCB

Payment & Shipping Terms
Minimum Order Quantity
1pcs
Price
Negotiation
Packaging Details
Vacuum package
Delivery Time
5- 10 days
Payment Terms
Negotiation, T/T
Product Description

Product features:


This rigid circuit board is used Ceramic substrate lamination WL-CT338.The ceramic substrate material is widely used in electronic packaging substrate for its advantages such as high strength, good insulation, good thermal conductivity and heat resistance, small thermal expansion coefficient and good chemical stability.

 

Product type High Frequency PCB
Materail Ceramic substrate lamination WL-CT338
Board thickness 0.544+/-10%mm
Copper thickness 1/1 OZ
Surface finish Immersion sliver
Holes Via in pad, resin plugging and plated over
Soldermask Green or per customer demand

 

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86-153-8898-3110
Room 401,No.5 Building, Dingfeng Technology Park, Shayi Community, Shajing Town, Bao'an District,Shenzhen,Guangdong Province,China
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