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Communication Blind Buried Via PCB FR4 High Frequency Board 4 Layer

Basic Information
Material: FR4 Layer Count: 4
Surface Finishing: ENIG Size: 118.00mm*57.50mm
Board Thickness: 1.6mm Min. Hole Size: 0.25mm

Communication Blind Buried Via PCB


Blind Buried Via PCB


FR4 High Frequency Board

4 layer/High frequency mixed pressure PCB /Communication blind buried via/FR4/ENIG


HFPs are electronic components used for many different applications, from radio communication to high-performance computing. HFPs are highly versatile components used in the development of complex electronic systems. They are the backbone of modern electronics.


Specialized materials, such as ceramic-filled epoxy resin and high-temperature polyimide, are often used in these applications. These materials provide the desired performance and durability, while also offering a cost-effective solution.


As the demand for more powerful, efficient, and cost-effective electronics has grown, so too has the need for high frequency PCBs. These HFPs offer a number of advantages, including increased signal integrity, enhanced power delivery, and improved performance. Additionally, HFPs can be designed to meet tight physical constraints, making them ideal for use in a wide range of applications.


If you are looking for the best in High frequency PCBs, look no further than Golden Triangle Group. We have the experience, knowledge, and quality to provide the best product for your needs. With our expertise and customer service, you can be sure that your product will be manufactured to the highest standards.


Contact Details

Phone Number : +8615388983110

WhatsApp : +8615388983110