| MOQ: | 1 panel |
| Price: | Negotiation |
| Payment Terms: | T/T |
Technical Parameters:
| Product Name | Rogers PCB |
| Type | Hybrid Stack Up Board |
| Layer Number | 2 Layer |
| Copper Thickness | 1 OZ |
| Cu Thickness | 35 UM |
| Thermal Conductivity | 0.6 To 0.9 W/mK |
| Dielectric Constant | 2.2 To 10.2 |
| Surface Finishing | ENIG |
| SMT Efficiency | BGA, QFP, SOP, QFN, PLCC, CHIP |
| Multilayer Stack Up | Stack Up, Control Impedance |