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Immersion Gold PCB Board Assembly 1oz Rogers RO3003 Lead Free HASL

Basic Information
Base Material: FR4, ROGERS Copper Thickness: 1oz
Board Thickness: 1.6mm Min. Hole Size: 0.2mm
Min. Line Width: 3.5mil Min Line Spacing: 3.5mil
Surface Finishing: Lead Free HASL, Immersion Gold Solder Mask Color: Green
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Immersion Gold PCB Board Assembly

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PCB Board Assembly 1oz

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Rogers RO3003

Rogers RO3003 PCB Board Manufacturing And PCB Assembly/Lead free HASL/Immersion gold/1oz/green

 

Rogers RO3003 is a ceramic-filled PTFE laminate that can be used for RF and microwave applications up to 40 GHz. The dielectric constant of the laminate is 3 (8-40 GHz), which can provide excellent plated through-hole reliability even in severe high-temperature environments. Its coefficient of thermal expansion (CTE) on the X and Y axis is 17 ppm/℃, and the coefficient of thermal expansion (CTE) on the Z-axis is 24 ppm/℃. This coefficient of expansion matches that of copper, allowing the material to exhibit excellent dimensional stability, and the typical etch shrinkage (after etching and baking) is less than 0.5 mils per inch.

 

Rogers RO3003 Features

Rogers RO3003 Applications

 

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Contact Details
Alice

Phone Number : +8615388983110

WhatsApp : +8615388983110