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8 layer Heavy Copper PCB for and Resin Plugging Plated Processing Technology
  • 8 layer Heavy Copper PCB for  and Resin Plugging Plated Processing Technology

8 layer Heavy Copper PCB for and Resin Plugging Plated Processing Technology

Brand Name Customized
Certification ISO9001, ISO14001,TS16949, ISO13485
Product Details
Layer:
8 Layer, FR4 TG170
Pcba Service:
SMD SMT DIP Component Assembly
Solder Mask Color:
Green, Red, Blue, Black, White
Standard Testing:
IPC Class 2
Insulation Materials:
Epoxy Resin+ Plated
Minimum Hole Size:
0.2mm
Test:
IPC Class 2
Board Thickness:
2.0-3.2mm
Min Hole Size:
0.2MM
Payment & Shipping Terms
Minimum Order Quantity
1 set
Price
Negotiation
Packaging Details
Vacuum package
Delivery Time
2 -3 weeks
Payment Terms
T/T
Supply Ability
Flexible
Product Description

Benefits and Advantages

The use of heavy copper PCBs provides several significant benefits:


High Current Carrying Capacity: This is the most notable advantage. The thicker copper traces can handle substantially higher currents—from 10 to hundreds of amperes—compared to standard PCBs, preventing trace burnout and electrical failures.


Superior Thermal Management: Copper is an excellent thermal conductor. The thicker copper layers effectively spread and dissipate heat away from critical components, reducing the risk of overheating and extending the lifespan of the electronic device.


Enhanced Mechanical Strength: The robust copper structure provides greater durability and resistance to thermal stress, vibration, and physical shock. This makes heavy copper PCBs ideal for use in harsh environments.


Integration of Power and Control Circuits: Heavy copper plating technology allows for the integration of high-current power circuits and low-current control circuits on the same board, simplifying the design, reducing the overall size, and potentially lowering costs.


Reduced Product Size: By using thicker copper, designers can achieve the required current-carrying capacity with narrower traces, which can help to reduce the overall size and layer count of the PCB.


Technical Parameters:

PCB Layer 8 layer
Insulation Materials Epoxy Resin
Test IPC Class 2
Copper Thickness 3oz-5oz
Processing Technology Resin Plugging+ Plated
Pcba Service SMD SMT DIP Component Assembly
Standard Testing IPC Class 2
Minimum Hole Size 0.2mm
Item Custom Circuit Board
Solder Mask Color Green, Red, Blue, Black, White


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