2024-09-12
PCB panelization is the process of arranging multiple PCB boards on a large substrate for manufacturing and assembly.
1. Improve production efficiency
By simultaneously manufacturing multiple PCB boards on a large substrate, production efficiency can be improved. Processing multiple boards in the same process reduces the time required for clamping, alignment, and cutting, thereby improving overall manufacturing speed.
2. Reduce production costs
Splicing allows multiple PCB boards to share some production resources and tools, such as masks, drilling, metallurgy etc. This can reduce the manufacturing cost of each board, as certain steps only need to be performed once instead of for each individual board.
3. Simplify the assembly process:
When multiple PCB boards are assembled on a large substrate, the assembly process becomes more convenient. Components can be installed simultaneously on the entire substrate, reducing the number of alignment and assembly times and improving assembly efficiency.
4. Convenient testing and debugging
The assembled PCB board can be tested and debugged more easily. The testing equipment can be applied to the entire substrate simultaneously, thereby reducing testing time and improving testing coverage.
5. Improve the mechanical stability of circuit boards
By fixing multiple PCB boards on a large substrate, additional mechanical stability and rigidity can be provided. This helps reduce the risk of PCB board bending, twisting, or vibration, and improve the overall structural reliability.
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