2024-09-12
Package refers to connecting the circuit pins on a silicon wafer to external connectors using wires, in order to connect with other devices. The packaging form refers to the outer shell used for installing semiconductor integrated circuit chips. It not only plays a role in installing, fixing, sealing, protecting chips, and enhancing thermal performance, but also connects to the pins of the packaging shell through the contacts on the chip with wires. These pins are then connected to other devices through wires on the printed circuit board, thus achieving the connection between the internal chip and the external circuit.
The common types of surface mount packaging are as follows:
SOP (Small Outline Package): Suitable for small and medium-sized integrated circuits.
QFP (Quad Flat Package): Suitable for high-density integrated circuits.
BGA (Ball Grid Array): Connected to the solder pads on the PCB through solder balls soldered at the bottom of the package.
CSP (Chip Scale Package): The chip package size is close to the chip size, which can achieve higher integration.
LGA (Land Grid Array): Pin grid array packaging, connected to solder pads on the PCB through pins soldered at the bottom of the package.
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