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OEM 4 Layer Circuit Board ENIG PCB Material FR4 1oz Plating Gold 30u”
  • OEM 4 Layer Circuit Board ENIG PCB Material FR4 1oz Plating Gold 30u”

OEM 4 Layer Circuit Board ENIG PCB Material FR4 1oz Plating Gold 30u”

Place of Origin China
Brand Name Customized
Certification UL,ISO9001
Product Details
Layers:
4L
Material:
FR4+Isola
Board Thickness:
1.6mm
OEM:
YES
Surface Treatmnet:
ENIG+Plating Gold 30u”
Name:
Printed Circuit Board
Highlight: 

OEM 4 Layer Circuit Board

,

4 Layer Circuit Board ENIG

,

PCB Material FR4

Payment & Shipping Terms
Minimum Order Quantity
Negotiable
Price
Negotiable
Packaging Details
Vaccum package
Delivery Time
Negotiable
Payment Terms
T/T
Product Description

Layer 4L FR4+Isola High Frequency PCB _1.6mm_ENIG 1oz Plating gold 30u”

 

HFPs are composed of complex material layers that are optimized for high-frequency performance. The material layers of an HFP must be carefully selected and combined to ensure optimal performance. Each layer is essential for the proper functioning of the PCB and its performance.

Layers 4L
Material FR4+Isola
Board thickness 1.6mm
Copper thickness 1oz
Surface treatmnet ENIG+Plating gold 30u”

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86-153-8898-3110
Room 401,No.5 Building, Dingfeng Technology Park, Shayi Community, Shajing Town, Bao'an District,Shenzhen,Guangdong Province,China
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